DIRECT LIQUID COOLING
3x better cold plates
At a standard flow rate of 2 L/min, our cold plate achieves a thermal resistance of just 0.007 °C/W, approximately 70% lower than competing designs, including established high-performance fin architectures. That gap holds across the full tested range of 1-4 L/min.
Engineering breakthrough
Industry-leading thermal performance
Unmatched thermal resistance
At a standard flow rate of 2 L/min, our cold plate achieves a thermal resistance of just 0.007 °C/W, approximately 70% lower than competing designs, including established high-performance fin architectures. That gap holds across the full tested range of 1-4 L/min.
Efficiency at low flow rates
The advantage doesn't only appear at high flow. Even at 1 L/min, apheros cold plates maintain a thermal resistance that competitors struggle to reach. For system integrators, that translates directly into lower pump requirements, simpler cooling loops, and measurable energy savings.
Why the foam makes the difference
Apheros copper foam operates at 75% porosity, creating inherently turbulent flow and a dramatically higher heat exchange surface area than conventional fin or microchannel designs. The result: our cold plates deliver +75% better performance than the commercial standard for >1 kW GPU and CPU cooling applications, and 2x better performance than the current state-of-the-art. The technology is at TRL 6+, addressing a market already valued at over $1Bn in 2026.