12-15 OCTOBER, SAN JOSÉ
See you at OCP Global Summit 2026!
Join us at the Emerging Technology Demo section in the Innovation Village to see the next generation of high-performance cold plates with apheros metal foam cores.
OCP Global Summit is where the AI industry is shaping the future of data center IT infrastructure standards. Thermal management is one of the biggest open problems on the floor this year. We're not there to watch from the sidelines; we're there because we have something unique to add to that conversation.
What we do
Apheros grew out of ETH Zürich with a simple but hard-to-pull-off idea: build cooling hardware out of open-pore metal foam instead of the machined channels everyone's used to.
For data centers, that means cold plates with dramatically more internal surface area than conventional designs, so they move heat more efficiently, in a smaller footprint, without asking your system architects to redesign everything around them. Same form factor people already work with, just better at the one job that's becoming the bottleneck.
(We also use the same core foam technology for porous electrodes in green hydrogen electrolysis, but that's a story for another post.)
Let's talk
If you're at OCP Global Summit 2026 and thermal performance is on your roadmap, whether you're evaluating next-gen cold plate designs or just want to nerd out about metal foam, come find us. We'd love to show you what we've built and hear what problems you're actually trying to solve.