INNOVATIVE METAL FOAM SOLUTIONS
The Coolest Chip in the Rack
Apheros' novel metal foam cold plates are redefining direct-to-chip liquid cooling. Their ultra-high surface area, open porosity, and low density translate to unparalleled heat exchange, capable of cooling the most powerful AI chips.
Apheros inside
Our metal foam provides the cold plates with the lowest thermal resistance on the market, significantly improving the cooling system's efficiency.
Products
Due to the rapid growth of AI and high-performance computing, air cooling can no longer keep up with the extreme cooling demands of the most advanced CPUs and GPUs with TDP >2000W.
The solution is direct-to-chip liquid cooling.
Apheros metal foam, with its ultra-high surface area, open porosity, and industry-leading thermal resistance, is uniquely positioned to keep the next generation chips cool. The apheros metal foams can be used in single- and two-phase DLC.
Beyond thermal performance, our materials excel in a wide range of applications, including green hydrogen production, energy storage, catalysis, high-temperature filtration, and more.
Technology
The performance of apheros cold plates comes from the material itself, a patented metal foam with 1,000× the surface area of conventional alternatives.
Fully open porosity ensures optimal fluid flow, and the manufacturing process is tunable per application. Metal composition, porosity, and pore size can be adjusted without retooling.
A drop-in replacement for existing liquid cooling infrastructure.
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